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In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs
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In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs
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Date
2012
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
De Wolf, Ingrid
;
Simons, Veerle
;
Cherman, Vladimir
;
Labie, Riet
;
Vandevelde, Bart
;
Beyne, Eric
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1898
since deposited on 2021-10-20
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last month
Acq. date: 2026-01-06
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Metrics
Views
1898
since deposited on 2021-10-20
2
last month
Acq. date: 2026-01-06
Citations