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CDM ESD testing of a 3D TSV stacked IC chip
Publication:
CDM ESD testing of a 3D TSV stacked IC chip
Date
2014-10
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Nagata, Nagata
;
Takaya, Satoshi
;
Ikeda, Hiroaki
;
Linten, Dimitri
;
Scholz, Mirko
;
Chen, Shih-Hung
;
Hasegawa, Keiichi
;
Shintani, Taizo
;
Sawada, Masanori
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2081
since deposited on 2021-10-22
469
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
2081
since deposited on 2021-10-22
469
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations