Publication:

CDM ESD testing of a 3D TSV stacked IC chip

Date

2014-10

Meeting abstract

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Author(s)

Nagata, Nagata

;

Takaya, Satoshi

;

Ikeda, Hiroaki

;

Linten, Dimitri

;

Scholz, Mirko

;

Chen, Shih-Hung

;

Hasegawa, Keiichi

;

Shintani, Taizo

;

Sawada, Masanori

Metrics

2083 since deposited on 2021-10-22

Acq. date: 2025-12-10