Publication:

Full reliability study of advanced metallization options for 30 nm ½pitch interconnects

Date

2013
Journal article
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dc.contributor.authorCroes, Kristof
dc.contributor.authorDemuynck, Steven
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorWilson, Chris
dc.contributor.authorHeylen, Nancy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-21T07:05:10Z
dc.date.available2021-10-21T07:05:10Z
dc.date.issued2013
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22186
dc.source.beginpage210
dc.source.endpage213
dc.source.journalMicroelectronic Engineering
dc.source.volume106
dc.title

Full reliability study of advanced metallization options for 30 nm ½pitch interconnects

dc.typeJournal article
dspace.entity.typePublication
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