Publication:
High bandwidth interconnects via a novel chip-stack package
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-14T21:08:52Z | |
| dc.date.available | 2021-10-14T21:08:52Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2002 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6011 | |
| dc.source.beginpage | S19 | |
| dc.source.endpage | S22 | |
| dc.source.issue | 4 | |
| dc.source.journal | Solid State Technology | |
| dc.source.volume | 45 | |
| dc.title | High bandwidth interconnects via a novel chip-stack package | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |