Publication:
Post-bond interconnect test and diagnosis for 3D memory stacked on logic
Date
| dc.contributor.author | Taouil, Mottaqiallah | |
| dc.contributor.author | Masadeh, Mahmoud | |
| dc.contributor.author | Hamdioui, Said | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-22T23:28:24Z | |
| dc.date.available | 2021-10-22T23:28:24Z | |
| dc.date.issued | 2015-11 | |
| dc.identifier.issn | 0278-0070 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25984 | |
| dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7105883 | |
| dc.source.beginpage | 1860 | |
| dc.source.endpage | 1872 | |
| dc.source.issue | 11 | |
| dc.source.journal | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) | |
| dc.source.volume | 34 | |
| dc.title | Post-bond interconnect test and diagnosis for 3D memory stacked on logic | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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