Publication:
Development of sub-10-nm atomic layer deposition barriers for Cu/low-k interconnects
Date
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Satta, Alessandra | |
| dc.contributor.author | Schuhmacher, Jörg | |
| dc.contributor.author | Maex, Karen | |
| dc.contributor.author | Besling, Wim | |
| dc.contributor.author | Kilpela, Olli | |
| dc.contributor.author | Sprey, Hessel | |
| dc.contributor.author | Tempel, Georg | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.contributor.imecauthor | Sprey, Hessel | |
| dc.date.accessioned | 2021-10-14T21:08:48Z | |
| dc.date.available | 2021-10-14T21:08:48Z | |
| dc.date.issued | 2002 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6009 | |
| dc.source.beginpage | 233 | |
| dc.source.endpage | 245 | |
| dc.source.issue | 1_4 | |
| dc.source.journal | Microelectronic Engineering | |
| dc.source.volume | 64 | |
| dc.title | Development of sub-10-nm atomic layer deposition barriers for Cu/low-k interconnects | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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