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Development of integrated wet cleans for 3D-SIC technologies

Date

2013
Proceedings Paper
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dc.contributor.authorSuhard, Samuel
dc.contributor.authorSimms, Ihsan
dc.contributor.authorBrown, Ian
dc.contributor.authorShogo, Mizota
dc.contributor.authorKoji, Kagawa
dc.contributor.authorClaes, Martine
dc.contributor.authorBuisson, Thibault
dc.contributor.authorJourdain, Anne
dc.contributor.authorBeyer, Gerald
dc.contributor.authorDe Gendt, Stefan
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-21T12:27:08Z
dc.date.available2021-10-21T12:27:08Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23133
dc.identifier.urlhttp://www.scientific.net/SSP.195.150
dc.source.beginpage150
dc.source.conferenceUltra Clean Processing of Semiconductor Surfaces XI - UCPSS
dc.source.conferencedate17/09/2012
dc.source.conferencelocationGent Belgium
dc.source.endpage153
dc.title

Development of integrated wet cleans for 3D-SIC technologies

dc.typeProceedings paper
dspace.entity.typePublication
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