Publication:

Segregation of Cu on etched and non-etched Al(Cu) surface

Date

1998
Proceedings Paper
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dc.contributor.authorLi, Hua
dc.contributor.authorMaex, Karen
dc.contributor.authorBrijs, Bert
dc.contributor.authorConard, Thierry
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorBoullart, Werner
dc.contributor.authorFroyen, L.
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.date.accessioned2021-10-01T08:29:00Z
dc.date.available2021-10-01T08:29:00Z
dc.date.embargo9999-12-31
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2723
dc.source.beginpage77
dc.source.conferenceMaterials Reliability in Microelectronics VIII
dc.source.conferencedate13/04/1998
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage82
dc.title

Segregation of Cu on etched and non-etched Al(Cu) surface

dc.typeProceedings paper
dspace.entity.typePublication
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