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Co-implantation with conventional spike anneal solutions for 45 nm ultra-shallow junction formation

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dc.contributor.authorCollart, E.H.
dc.contributor.authorFelch, S.B.
dc.contributor.authorGraoui, H.
dc.contributor.authorKirkwood, D.
dc.contributor.authorPawlak, Bartek
dc.contributor.authorAbsil, Philippe
dc.contributor.authorSeveri, Simone
dc.contributor.authorJanssens, Tom
dc.contributor.authorVandervorst, Wilfried
dc.contributor.imecauthorPawlak, Bartek
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.imecauthorSeveri, Simone
dc.contributor.imecauthorVandervorst, Wilfried
dc.date.accessioned2021-10-16T01:00:52Z
dc.date.available2021-10-16T01:00:52Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10248
dc.source.conferenceUSJ - The 8th Int. Workshop on the Fabrication, Characterization and Modeling of Ultra Shallow Junctions in Semiconductors
dc.source.conferencedate5/06/2005
dc.source.conferencelocationDaytona Beach, FL USA
dc.title

Co-implantation with conventional spike anneal solutions for 45 nm ultra-shallow junction formation

dc.typeProceedings paper
dspace.entity.typePublication
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