Publication:
Analysis of 3D interconnect performances Versus Si interposer substrate resistivity
Date
| dc.contributor.author | Sun, Xiao | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Detalle, Mikael | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Sun, Xiao | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Detalle, Mikael | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-22T06:14:52Z | |
| dc.date.available | 2021-10-22T06:14:52Z | |
| dc.date.issued | 2014 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24576 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | IEEE 3D System Integration Conference - 3DIC | |
| dc.source.conferencedate | 1/12/2014 | |
| dc.source.conferencelocation | Kinsale Ireland | |
| dc.source.endpage | 4 | |
| dc.title | Analysis of 3D interconnect performances Versus Si interposer substrate resistivity | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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