Publication:

Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene processing

Date

2023
Proceedings Paper
https://doi.org/10.1109/ECTC51909.2023.00233
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dc.contributor.authorPinho, Nelson
dc.contributor.authorChery, Emmanuel
dc.contributor.authorPantano, Nicolas
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPinho, Nelson
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimecPantano, Nicolas::0000-0002-8803-8374
dc.contributor.orcidimecSlabbekoorn, John::0000-0002-6098-8618
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2023-11-22T11:29:41Z
dc.date.available2023-10-23T17:27:27Z
dc.date.available2023-11-22T11:29:41Z
dc.date.issued2023
dc.identifier.doi10.1109/ECTC51909.2023.00233
dc.identifier.eisbn979-8-3503-3498-2
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42910
dc.publisherIEEE
dc.source.beginpage1364
dc.source.conferenceIEEE 73rd Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 30-JUN 02, 2023
dc.source.conferencelocationOrlando
dc.source.endpage1368
dc.source.journalna
dc.source.numberofpages5
dc.subject.keywordsRELIABILITY
dc.title

Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene processing

dc.typeProceedings paper
dspace.entity.typePublication
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