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Conference contributions
FET arrays as CPI sensors for 3D stacking and packaging characterization
Publication:
FET arrays as CPI sensors for 3D stacking and packaging characterization
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Date
2012
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ivankovic, Andrej
;
Cherman, Vladimir
;
Van der Plas, Geert
;
Vandevelde, Bart
;
Beyer, Gerald
;
Beyne, Eric
;
De Wolf, Ingrid
;
Vandepitte, Dirk
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1931
since deposited on 2021-10-20
Acq. date: 2025-12-10
Citations
Metrics
Views
1931
since deposited on 2021-10-20
Acq. date: 2025-12-10
Citations