Publication:

Different failure signatures of multiple TLP and HBM stresses in an ESD robust protection structure

Date

2005
Journal article
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dc.contributor.authorGuitard, Nicolas
dc.contributor.authorEssely, Fabien
dc.contributor.authorTremouilles, David
dc.contributor.authorBafleur, Marise
dc.contributor.authorNolhier, Nicolas
dc.contributor.authorPerdu, Philippe
dc.contributor.authorTouboul, Andre
dc.contributor.authorPouget, Vincent
dc.contributor.authorLewis, Dean
dc.date.accessioned2021-10-16T01:51:51Z
dc.date.available2021-10-16T01:51:51Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10535
dc.source.beginpage1415
dc.source.endpage1420
dc.source.issue9_11
dc.source.journalMicroelectronics Reliability
dc.source.volume45
dc.title

Different failure signatures of multiple TLP and HBM stresses in an ESD robust protection structure

dc.typeJournal article
dspace.entity.typePublication
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