Publication:

MEMS 0-level packaging using thin film poly-SiGe caps

Date

2002-09
Proceedings Paper
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dc.contributor.authorRusu, Cristina
dc.contributor.authorVerbist, Agnes
dc.contributor.authorParmentier, Brigitte
dc.contributor.authorWitvrouw, Ann
dc.contributor.imecauthorParmentier, Brigitte
dc.date.accessioned2021-10-14T23:00:08Z
dc.date.available2021-10-14T23:00:08Z
dc.date.issued2002-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6780
dc.source.conferenceIMAPS ATW on Packaging of MEMS and Related Micro Integrated Nano Systems
dc.source.conferencedate6/09/2002
dc.source.conferencelocationDenver, CO USA
dc.title

MEMS 0-level packaging using thin film poly-SiGe caps

dc.typeProceedings paper
dspace.entity.typePublication
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