Publication:

Low-k dielectric reliability: impact of test structure choice, copper and integrated dielectric quality

Date

2008
Proceedings Paper
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dc.contributor.authorTokei, Zsolt
dc.contributor.authorLi, Yunlong
dc.contributor.authorCiofi, Ivan
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-17T11:19:56Z
dc.date.available2021-10-17T11:19:56Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14566
dc.source.beginpage111
dc.source.conference11th IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate1/06/2008
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage113
dc.title

Low-k dielectric reliability: impact of test structure choice, copper and integrated dielectric quality

dc.typeProceedings paper
dspace.entity.typePublication
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