Publication:

Low-frequency noise measurements to characterize Cu-electromigration down to 44nm metal pitch

Date

2019
Proceedings Paper
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dc.contributor.authorBeyne, Sofie
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorBeyne, Sofie
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-27T07:34:22Z
dc.date.available2021-10-27T07:34:22Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32539
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8720562
dc.source.beginpage1
dc.source.conferenceIEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedate31/03/2019
dc.source.conferencelocationMonterey, CA USA
dc.source.endpage6
dc.title

Low-frequency noise measurements to characterize Cu-electromigration down to 44nm metal pitch

dc.typeProceedings paper
dspace.entity.typePublication
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