Publication:

Packaged Cost-Effective Millimeterwave Air-Filled SIW Components for Array Feed Networks

Date

2023
Proceedings Paper
https://doi.org/10.1109/EDAPS58880.2023.10468222
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dc.contributor.authorVan Messem, Laura
dc.contributor.authorMoerman, Arno
dc.contributor.authorCaytan, Olivier
dc.contributor.authorVande Ginste, Dries
dc.contributor.authorRogier, Hendrik
dc.contributor.authorLemey, Sam
dc.contributor.imecauthorVan Messem, Laura
dc.contributor.imecauthorMoerman, Arno
dc.contributor.imecauthorCaytan, Olivier
dc.contributor.imecauthorVande Ginste, Dries
dc.contributor.imecauthorRogier, Hendrik
dc.contributor.imecauthorLemey, Sam
dc.contributor.orcidimecVan Messem, Laura::0000-0003-3845-9397
dc.contributor.orcidimecMoerman, Arno::0000-0003-0945-2786
dc.contributor.orcidimecCaytan, Olivier::0000-0002-1524-971X
dc.contributor.orcidimecVande Ginste, Dries::0000-0002-0178-288X
dc.contributor.orcidimecRogier, Hendrik::0000-0001-8139-2736
dc.contributor.orcidimecLemey, Sam::0000-0003-1366-2604
dc.date.accessioned2024-08-05T07:56:06Z
dc.date.available2024-06-29T17:02:55Z
dc.date.available2024-07-31T10:08:13Z
dc.date.available2024-08-05T07:56:06Z
dc.date.embargo2023-12-14
dc.date.issued2023
dc.description.wosFundingTextThis research was partially funded by the Methusalem funding of the Flemish Government under Grant "SHAPE: Next Generation Wireless Networks," and in part by the European Research Council through "ATTO: A new concept for ultrahigh capacity wireless networks" under Grant 695495.
dc.identifier.doi10.1109/EDAPS58880.2023.10468222
dc.identifier.eisbn979-8-3503-8376-8
dc.identifier.issn2151-1225
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44105
dc.publisherIEEE
dc.source.conferenceIEEE Conference on Electrical Design of Advanced Packaging and Systems (IEEE EPS EDAPS) - Semiconductor Packaging - The Next Frontier
dc.source.conferencedateDEC 12-14, 2023
dc.source.conferencelocationMauritius
dc.source.journal/
dc.source.numberofpages3
dc.title

Packaged Cost-Effective Millimeterwave Air-Filled SIW Components for Array Feed Networks

dc.typeProceedings paper
dspace.entity.typePublication
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