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Selective wet etching of Hf-based layers on a single-wafer spin processor

Date

2004
Proceedings Paper
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dc.contributor.authorKraus, Harald
dc.contributor.authorKovacs, F.
dc.contributor.authorSnow, Jim
dc.contributor.authorClaes, Martine
dc.contributor.authorParaschiv, Vasile
dc.contributor.authorVos, Rita
dc.contributor.authorMertens, Paul
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorHeyns, Marc
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorParaschiv, Vasile
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-15T14:14:47Z
dc.date.available2021-10-15T14:14:47Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9146
dc.source.beginpage485
dc.source.conferenceProceedings of the 3rd International Conference on Semiconductor Technology - ISTC
dc.source.conferencedate15/09/2004
dc.source.conferencelocationShanghai China
dc.source.endpage492
dc.title

Selective wet etching of Hf-based layers on a single-wafer spin processor

dc.typeProceedings paper
dspace.entity.typePublication
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