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Integration of low stress photopatternable silicones into a wafer level package
Publication:
Integration of low stress photopatternable silicones into a wafer level package
Date
2004-06
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Gardner, G.
;
Harkness, B.
;
Ohare, E.
;
Meynen, H.
;
Vanden Bulcke, Mathieu
;
Gonzalez, Mario
;
Beyne, Eric
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1909
since deposited on 2021-10-15
Acq. date: 2025-10-24
Citations
Metrics
Views
1909
since deposited on 2021-10-15
Acq. date: 2025-10-24
Citations