Publication:

Thick adhesive temporary bonding for high topography applications: spin-on versus dry bonding film processes

Date

2014
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorJourdain, Anne
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorGuerrero, Alice
dc.contributor.authorBailey, Susan
dc.contributor.authorPrivett, Mark
dc.contributor.authorArnold, Kim
dc.contributor.authorMiller, Andy
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T02:23:44Z
dc.date.available2021-10-22T02:23:44Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24017
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6897393&queryText%3DThick+adhesive+temporary+bonding+for+high+top
dc.source.beginpage894
dc.source.conferenceIEEE 64th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2014
dc.source.conferencelocationLake Buena Vista, FL USA
dc.source.endpage898
dc.title

Thick adhesive temporary bonding for high topography applications: spin-on versus dry bonding film processes

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
28009.pdf
Size:
2.95 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions