Publication:

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling

Date

2018
Proceedings Paper
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dc.contributor.authorVandooren, Anne
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorFranco, Jacopo
dc.contributor.authorMallik, Arindam
dc.contributor.authorParvais, Bertrand
dc.contributor.authorWu, Z.
dc.contributor.authorWalke, Amey
dc.contributor.authorDeshpande, Paru
dc.contributor.authorRosseel, Erik
dc.contributor.authorHikavyy, Andriy
dc.contributor.authorLi, Waikin
dc.contributor.authorPeng, L.
dc.contributor.authorRassoul, Nouredine
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorDevriendt, Katia
dc.contributor.authorTeugels, Lieve
dc.contributor.authorHeylen, Nancy
dc.contributor.authorVecchio, Emma
dc.contributor.imecauthorVandooren, Anne
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorMallik, Arindam
dc.contributor.imecauthorParvais, Bertrand
dc.contributor.imecauthorWalke, Amey
dc.contributor.imecauthorDeshpande, Paru
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorHikavyy, Andriy
dc.contributor.imecauthorLi, Waikin
dc.contributor.imecauthorRassoul, Nouredine
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVecchio, Emma
dc.contributor.imecauthorWaldron, Niamh
dc.contributor.imecauthorDe Heyn, Vincent
dc.contributor.orcidimecVandooren, Anne::0000-0002-2412-0176
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecMallik, Arindam::0000-0002-0742-9366
dc.contributor.orcidimecParvais, Bertrand::0000-0003-0769-7069
dc.contributor.orcidimecDeshpande, Paru::0000-0002-9693-5761
dc.contributor.orcidimecHikavyy, Andriy::0000-0002-8201-075X
dc.contributor.orcidimecRassoul, Nouredine::0000-0001-9489-3396
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.accessioned2021-10-26T07:53:03Z
dc.date.available2021-10-26T07:53:03Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32140
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8399777/
dc.source.beginpage145
dc.source.conferenceInternational Conference on IC Design and Technology - ICICDT
dc.source.conferencedate4/06/2018
dc.source.conferencelocationOtranto Italy
dc.source.endpage148
dc.title

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling

dc.typeProceedings paper
dspace.entity.typePublication
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