Publication:

Using Programmed defect vehicle to understand printability of defect/2D structures and characterize it through EUV process impact

Date

2025
Proceedings Paper
https://doi.org/10.1117/12.3052510
Simple item page Full metadata Statistics
 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-6314-2685
cris.virtual.orcid0000-0002-5651-7768
cris.virtual.orcid0009-0002-5784-619X
cris.virtual.orcid0000-0002-3103-9106
cris.virtual.orcid0000-0002-3571-1633
cris.virtual.orcid0000-0002-5153-5553
cris.virtual.orcid0000-0003-1356-9186
cris.virtual.orcid0009-0000-3384-8540
cris.virtualsource.department1fc7b9f7-9367-45d8-be12-90bcb20ebcbd
cris.virtualsource.departmente4a0e7a3-4f39-4fc2-8a5a-e6a56e041d34
cris.virtualsource.department0589bf6f-5e0f-4149-be36-f10e7e682cbb
cris.virtualsource.department24b889e8-5beb-4daf-a72c-3c5a3d91b285
cris.virtualsource.departmentd407aca5-93a7-41d4-8f49-f8789954593d
cris.virtualsource.departmentffd8a134-0b6a-4f97-aaa5-978cf9f456c2
cris.virtualsource.department5ce755b6-7aea-44b8-9603-179aa300e12d
cris.virtualsource.department39ffd6c3-9161-4c05-9b59-66e46fdee6b8
cris.virtualsource.orcid1fc7b9f7-9367-45d8-be12-90bcb20ebcbd
cris.virtualsource.orcide4a0e7a3-4f39-4fc2-8a5a-e6a56e041d34
cris.virtualsource.orcid0589bf6f-5e0f-4149-be36-f10e7e682cbb
cris.virtualsource.orcid24b889e8-5beb-4daf-a72c-3c5a3d91b285
cris.virtualsource.orcidd407aca5-93a7-41d4-8f49-f8789954593d
cris.virtualsource.orcidffd8a134-0b6a-4f97-aaa5-978cf9f456c2
cris.virtualsource.orcid5ce755b6-7aea-44b8-9603-179aa300e12d
cris.virtualsource.orcid39ffd6c3-9161-4c05-9b59-66e46fdee6b8
dc.contributor.authorReddy, Bojja Aditya
dc.contributor.authorBaskaran, Balakumar
dc.contributor.authorSaib, Mohamed
dc.contributor.authorFranke, Joern-Holger
dc.contributor.authorBeral, Christophe
dc.contributor.authorPak, Murat
dc.contributor.authorHalder, Sandip
dc.contributor.authorDusa, Mircea
dc.contributor.imecauthorReddy, Bojja Aditya
dc.contributor.imecauthorBaskaran, Balakumar
dc.contributor.imecauthorSaib, Mohamed
dc.contributor.imecauthorFranke, Joern-Holger
dc.contributor.imecauthorBeral, Christophe
dc.contributor.imecauthorPak, Murat
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorDusa, Mircea
dc.contributor.orcidimecReddy, Bojja Aditya::0000-0002-3103-9106
dc.contributor.orcidimecBaskaran, Balakumar::0000-0002-5651-7768
dc.contributor.orcidimecSaib, Mohamed::0000-0002-5153-5553
dc.contributor.orcidimecFranke, Joern-Holger::0000-0002-3571-1633
dc.contributor.orcidimecBeral, Christophe::0000-0003-1356-9186
dc.contributor.orcidimecPak, Murat::0009-0002-5784-619X
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecDusa, Mircea::0009-0000-3384-8540
dc.date.accessioned2025-07-28T03:57:58Z
dc.date.available2025-07-28T03:57:58Z
dc.date.issued2025
dc.description.wosFundingTextThis work has been enabled in part by NanoIC pilot line. The acquisition and operation are jointly funded by the Chips Joint Undertaking, through the European Union's Digital Europe (101183266) and Horizon Europe Programs (101183277) as well as by the participating states Belgium (Flanders), France, Germany, Finland, Ireland and Romania. For more information, visit nanoic-project.eu. Authors also would like to thank INTEL.
dc.identifier.doi10.1117/12.3052510
dc.identifier.eisbn978-1-5106-8639-7
dc.identifier.isbn978-1-5106-8638-0
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45963
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpage134261X-1
dc.source.conference2025 Conference on Metrology Inspection and Process Control-Annual
dc.source.conferencedate2025-02-24
dc.source.conferencelocationSan Jose
dc.source.endpage134261X-8
dc.source.journalProceedings of SPIE
dc.source.numberofpages8
dc.title

Using Programmed defect vehicle to understand printability of defect/2D structures and characterize it through EUV process impact

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions