Publication:

Surface treatment to enable low temperature and pressure copper direct bonding

Date

2016
Proceedings Paper
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dc.contributor.authorDubey, Vikas
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorBeyne, Eric
dc.contributor.authorGerets, Carine
dc.contributor.authorCooper, E.
dc.contributor.authorLaermans, Patrick
dc.contributor.authorDe Leersnijder, Koen
dc.contributor.authorBaumans, Kim
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorLaermans, Patrick
dc.contributor.imecauthorDe Leersnijder, Koen
dc.contributor.imecauthorBaumans, Kim
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-23T10:42:08Z
dc.date.available2021-10-23T10:42:08Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26585
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545767/?arnumber=7545767
dc.source.beginpage2435
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage2441
dc.title

Surface treatment to enable low temperature and pressure copper direct bonding

dc.typeProceedings paper
dspace.entity.typePublication
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