Publication:
Quantitative assessment of adhesion strength in hybrid bonded interfaces with varying metal contact density
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0003-4374-4854 | |
| cris.virtual.orcid | 0000-0002-4790-7772 | |
| cris.virtual.orcid | 0000-0002-4420-0966 | |
| cris.virtual.orcid | 0000-0002-3096-050X | |
| cris.virtualsource.department | b98b120a-aea4-4c29-835f-6fae89301f2f | |
| cris.virtualsource.department | 4625b82d-74d3-468b-8507-13595dbe9a58 | |
| cris.virtualsource.department | 5d18d34b-14b0-47d6-9d57-01cf8f1a8a92 | |
| cris.virtualsource.department | 67066e7b-3582-42ef-b040-694dc2e501ae | |
| cris.virtualsource.orcid | b98b120a-aea4-4c29-835f-6fae89301f2f | |
| cris.virtualsource.orcid | 4625b82d-74d3-468b-8507-13595dbe9a58 | |
| cris.virtualsource.orcid | 5d18d34b-14b0-47d6-9d57-01cf8f1a8a92 | |
| cris.virtualsource.orcid | 67066e7b-3582-42ef-b040-694dc2e501ae | |
| dc.contributor.author | Vanstreels, Kris | |
| dc.contributor.author | Okudur, Oguzhan Orkut | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Vanstreels, Kris | |
| dc.contributor.imecauthor | Okudur, Oguzhan Orkut | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
| dc.contributor.orcidimec | Okudur, Oguzhan Orkut::0000-0002-4790-7772 | |
| dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2025-08-09T03:57:12Z | |
| dc.date.available | 2025-08-09T03:57:12Z | |
| dc.date.issued | 2025-NOV 15 | |
| dc.identifier.doi | 10.1016/j.mee.2025.112384 | |
| dc.identifier.issn | 0167-9317 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/46040 | |
| dc.publisher | ELSEVIER | |
| dc.source.beginpage | 112384 | |
| dc.source.journal | MICROELECTRONIC ENGINEERING | |
| dc.source.numberofpages | 4 | |
| dc.source.volume | 300 | |
| dc.title | Quantitative assessment of adhesion strength in hybrid bonded interfaces with varying metal contact density | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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