Quantitative assessment of adhesion strength in hybrid bonded interfaces with varying metal contact density

dc.contributor.author	Vanstreels, Kris
dc.contributor.author	Okudur, Oguzhan Orkut
dc.contributor.author	Gonzalez, Mario
dc.contributor.author	Beyne, Eric
dc.contributor.imecauthor	Vanstreels, Kris
dc.contributor.imecauthor	Okudur, Oguzhan Orkut
dc.contributor.imecauthor	Gonzalez, Mario
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Vanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimec	Okudur, Oguzhan Orkut::0000-0002-4790-7772
dc.contributor.orcidimec	Gonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2025-08-09T03:57:12Z
dc.date.available	2025-08-09T03:57:12Z
dc.date.issued	2025-NOV 15
dc.identifier.doi	10.1016/j.mee.2025.112384
dc.identifier.issn	0167-9317
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/46040
dc.publisher	ELSEVIER
dc.source.beginpage	112384
dc.source.journal	MICROELECTRONIC ENGINEERING
dc.source.numberofpages	4
dc.source.volume	300
dc.title	Quantitative assessment of adhesion strength in hybrid bonded interfaces with varying metal contact density
dc.type	Journal article
dspace.entity.type	Publication
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