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Multilayer thin film technology for on- and off-chip rf system integration

Date

2005-12
Journal article
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dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorCarchon, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.accessioned2021-10-16T00:46:21Z
dc.date.available2021-10-16T00:46:21Z
dc.date.issued2005-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10100
dc.source.journalSemiconductor International, Packaging Edition
dc.title

Multilayer thin film technology for on- and off-chip rf system integration

dc.typeJournal article
dspace.entity.typePublication
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