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Light-induced capacitance alteration for non-destructive fault isolation in TSV structures for 3-D integration

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dc.contributor.authorJacobs, Kristof J.P.
dc.contributor.authorKhaled, Ahmad
dc.contributor.authorStucchi, Michele
dc.contributor.authorWang, Teng
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorJacobs, Kristof J.P.
dc.contributor.imecauthorKhaled, Ahmad
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecJacobs, Kristof J.P.::0000-0002-1081-3633
dc.contributor.orcidimecKhaled, Ahmad::0000-0003-2892-3176
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-23T11:29:50Z
dc.date.available2021-10-23T11:29:50Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26772
dc.source.conferenceInternational Symposium for Testing and Failure Analysis - ISTFA
dc.source.conferencedate6/11/2016
dc.source.conferencelocationForth Worth,TX USA
dc.title

Light-induced capacitance alteration for non-destructive fault isolation in TSV structures for 3-D integration

dc.typeProceedings paper
dspace.entity.typePublication
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