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From confined area to wafer level nanotopography metrology solution for process developments

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dc.contributor.authorKim, Tae-Gon
dc.date.accessioned2021-10-25T21:03:39Z
dc.date.available2021-10-25T21:03:39Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31059
dc.identifier.urlhttps://www.semiconchina.org/en/725
dc.source.conferenceChina Semiconductor Technology International Conference (CSTIC) Symposium V: CMP and Post-Polish Cleaning
dc.source.conferencedate11/03/2018
dc.source.conferencelocationShanghai China
dc.title

From confined area to wafer level nanotopography metrology solution for process developments

dc.typeMeeting abstract
dspace.entity.typePublication
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