Publication:

Characterization of through-silicon vias using laser terahertz emission microscopy

Date

2021
Journal article
https://doi.org/10.1038/s41928-021-00559-z
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dc.contributor.authorMurakami, Hironaru
dc.contributor.authorMurakami, Fumikazu
dc.contributor.authorSerita, Kazunori
dc.contributor.authorTonouchi, Masayoshi
dc.contributor.authorJacobs, Kristof
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorJacobs, Kristof
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidextTonouchi, Masayoshi::0000-0002-9284-3501
dc.contributor.orcidimecJacobs, Kristof J. P.::0000-0002-1081-3633
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2022-03-04T13:42:16Z
dc.date.available2022-03-04T13:42:16Z
dc.date.issued2021
dc.identifier.doi10.1038/s41928-021-00559-z
dc.identifier.issn2520-1131
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39308
dc.publisherNATURE PORTFOLIO
dc.source.beginpage202
dc.source.endpage207
dc.source.issue3
dc.source.journalNATURE ELECTRONICS
dc.source.numberofpages6
dc.source.volume4
dc.subject.keywordsRELIABILITY CHALLENGES
dc.subject.keywordsPROPAGATION
dc.title

Characterization of through-silicon vias using laser terahertz emission microscopy

dc.typeJournal article
dspace.entity.typePublication
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