Publication:
NbTiN based two-metal level semi-damascene interconnects, Josephson junctions and capacitors for Superconducting Digital Logic
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0003-3098-3266 | |
| cris.virtual.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0009-0006-1899-8210 | |
| cris.virtual.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-2213-9017 | |
| cris.virtual.orcid | 0000-0002-0029-6548 | |
| cris.virtual.orcid | 0000-0003-3545-3424 | |
| cris.virtual.orcid | 0000-0003-2329-5449 | |
| cris.virtual.orcid | 0000-0002-3684-5959 | |
| cris.virtual.orcid | 0000-0002-6864-2603 | |
| cris.virtual.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0009-0006-7501-9787 | |
| cris.virtual.orcid | 0009-0009-7686-4474 | |
| cris.virtual.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-5956-6485 | |
| cris.virtual.orcid | 0000-0002-8471-6297 | |
| cris.virtual.orcid | 0000-0001-8406-8122 | |
| cris.virtual.orcid | 0000-0003-4084-5705 | |
| cris.virtual.orcid | 0000-0001-9247-0090 | |
| cris.virtual.orcid | 0009-0008-2524-3611 | |
| cris.virtualsource.department | ac970577-14d8-401d-8a09-e2e81baa0fa7 | |
| cris.virtualsource.department | e05093c4-13d7-446c-80d9-9d5407875f83 | |
| cris.virtualsource.department | cbfc5c51-4cea-4272-85dc-c629cf03f025 | |
| cris.virtualsource.department | a418f78a-2d36-4676-9745-ca5b31f3cd24 | |
| cris.virtualsource.department | 36cb9391-be28-4977-b2c2-d9edec2738a2 | |
| cris.virtualsource.department | f6f17b49-e3c3-4223-9429-3bcd739eacc2 | |
| cris.virtualsource.department | 5345513e-14d5-47e9-a494-1dda4ed18864 | |
| cris.virtualsource.department | e3892fcf-6afa-4c46-b0bb-e8bfd007fcc8 | |
| cris.virtualsource.department | 0f6970e3-389f-45a0-9b0b-725086d5a539 | |
| cris.virtualsource.department | 7e7a618e-97a3-467b-86c5-382a18cb69ad | |
| cris.virtualsource.department | 723101cf-d335-49eb-9842-31c6340addfd | |
| cris.virtualsource.department | 142233a1-23aa-4920-8aa7-ea5d1b32e137 | |
| cris.virtualsource.department | aca5cb03-d1db-4889-a004-6b31bdca1901 | |
| cris.virtualsource.department | af7a2ba6-eb7f-4eb5-817b-079fe2e7c07b | |
| cris.virtualsource.department | c1bbf7c6-fe00-4d3e-9b77-5ac76d18c50a | |
| cris.virtualsource.department | 4a8262a6-f4c4-4846-b4dd-3b695db98f65 | |
| cris.virtualsource.department | 17a768fd-260a-4a64-9d1a-4fc5049fb236 | |
| cris.virtualsource.department | 4c195e49-8823-4ccc-a8c3-743b2d9c00cf | |
| cris.virtualsource.department | 802fe4ec-2cc9-4395-9e66-18049db55e52 | |
| cris.virtualsource.department | 26141b2a-ede3-4919-9e53-c785c2daa035 | |
| cris.virtualsource.orcid | ac970577-14d8-401d-8a09-e2e81baa0fa7 | |
| cris.virtualsource.orcid | e05093c4-13d7-446c-80d9-9d5407875f83 | |
| cris.virtualsource.orcid | cbfc5c51-4cea-4272-85dc-c629cf03f025 | |
| cris.virtualsource.orcid | a418f78a-2d36-4676-9745-ca5b31f3cd24 | |
| cris.virtualsource.orcid | 36cb9391-be28-4977-b2c2-d9edec2738a2 | |
| cris.virtualsource.orcid | f6f17b49-e3c3-4223-9429-3bcd739eacc2 | |
| cris.virtualsource.orcid | 5345513e-14d5-47e9-a494-1dda4ed18864 | |
| cris.virtualsource.orcid | e3892fcf-6afa-4c46-b0bb-e8bfd007fcc8 | |
| cris.virtualsource.orcid | 0f6970e3-389f-45a0-9b0b-725086d5a539 | |
| cris.virtualsource.orcid | 7e7a618e-97a3-467b-86c5-382a18cb69ad | |
| cris.virtualsource.orcid | 723101cf-d335-49eb-9842-31c6340addfd | |
| cris.virtualsource.orcid | 142233a1-23aa-4920-8aa7-ea5d1b32e137 | |
| cris.virtualsource.orcid | aca5cb03-d1db-4889-a004-6b31bdca1901 | |
| cris.virtualsource.orcid | af7a2ba6-eb7f-4eb5-817b-079fe2e7c07b | |
| cris.virtualsource.orcid | c1bbf7c6-fe00-4d3e-9b77-5ac76d18c50a | |
| cris.virtualsource.orcid | 4a8262a6-f4c4-4846-b4dd-3b695db98f65 | |
| cris.virtualsource.orcid | 17a768fd-260a-4a64-9d1a-4fc5049fb236 | |
| cris.virtualsource.orcid | 4c195e49-8823-4ccc-a8c3-743b2d9c00cf | |
| cris.virtualsource.orcid | 802fe4ec-2cc9-4395-9e66-18049db55e52 | |
| cris.virtualsource.orcid | 26141b2a-ede3-4919-9e53-c785c2daa035 | |
| dc.contributor.author | Pokhrel, Ankit | |
| dc.contributor.author | Perez Lozano, Daniel | |
| dc.contributor.author | Soulie, Jean-Philippe | |
| dc.contributor.author | Vangoidsenhoven, Diziana | |
| dc.contributor.author | Sarkar, Sujan Kumar | |
| dc.contributor.author | Saroj, Rajendra Kumar | |
| dc.contributor.author | Canvel, Yann | |
| dc.contributor.author | Renaud, Vincent | |
| dc.contributor.author | Kenens, Bart | |
| dc.contributor.author | Walke, Amey | |
| dc.contributor.author | Bizindavyi, Jasper | |
| dc.contributor.author | Iraci, Sara | |
| dc.contributor.author | Ibrahim, Seifallah | |
| dc.contributor.author | Hodges, Blake | |
| dc.contributor.author | Josephsen, Trent | |
| dc.contributor.author | Perumkunnil, Manu | |
| dc.contributor.author | Huet, Benjamin | |
| dc.contributor.author | O'Neal, Sabine | |
| dc.contributor.author | Herr, Quentin | |
| dc.contributor.author | Tokei, Zsolt | |
| dc.date.accessioned | 2026-05-11T08:51:01Z | |
| dc.date.available | 2026-05-11T08:51:01Z | |
| dc.date.createdwos | 2026-03-18 | |
| dc.date.issued | 2024 | |
| dc.description.abstract | Superconducting Digital (SCD) is a promising alternative to conventional complementary metal-oxide semiconductor (CMOS) technology, enabling high-speed and energy-efficient computing for Artificial Intelligence (AI) and High-Performance Computing (HPC). Here, we report the fabrication of three device modules that are the core building blocks for scalable SCD technology: 1) NbTiN BEOL interconnects, 2) NbTiN/aSi/NbTiN Josephson junctions (JJs), and 3) NbTiN/HZO/NbTiN tunable Metal-Insulator-Metal (MIM) capacitors. Material characterization and electrical measurements demonstrate high-quality superconducting devices with critical dimensions (CDs) down to 50 nm. NbTiN interconnects have critical temperature Tc>13K and high critical current density Jc>120mA/μm2, amorphous Si α Si) based JJs have JC>0.8mA/μm2, with a ICRN of ∼1.1mV. The tunable HZO MIM capacitors have high specific capacitance Cf of ∼28 fF/μm2 and k-value of 30. All devices were fabricated on 300 mm wafers within thermal budget of 420 ∘C using fabrication processes compatible with standard CMOS technology, representing many firsts, hence bridging the gap from feasibility studies to industrial fabrication. | |
| dc.description.wosFundingText | The work was supported by imec Invest+ grant and Osceola County, Florida. | |
| dc.identifier.doi | 10.1109/iedm50854.2024.10873563 | |
| dc.identifier.issn | 2380-9248 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/59405 | |
| dc.language.iso | eng | |
| dc.provenance.editstepuser | greet.vanhoof@imec.be | |
| dc.publisher | IEEE | |
| dc.source.conference | IEEE International Electron Devices Meeting (IEDM) | |
| dc.source.conferencedate | 2025-12-07 | |
| dc.source.conferencelocation | San Francisco | |
| dc.source.journal | 2024 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, IEDM | |
| dc.source.numberofpages | 4 | |
| dc.title | NbTiN based two-metal level semi-damascene interconnects, Josephson junctions and capacitors for Superconducting Digital Logic | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| imec.internal.crawledAt | 2026-04-07 | |
| imec.internal.source | crawler | |
| imec.internal.wosCreatedAt | 2026-04-07 | |
| Files | ||
| Publication available in collections: | ||