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NbTiN based two-metal level semi-damascene interconnects, Josephson junctions and capacitors for Superconducting Digital Logic

 
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dc.contributor.authorPokhrel, Ankit
dc.contributor.authorPerez Lozano, Daniel
dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorVangoidsenhoven, Diziana
dc.contributor.authorSarkar, Sujan Kumar
dc.contributor.authorSaroj, Rajendra Kumar
dc.contributor.authorCanvel, Yann
dc.contributor.authorRenaud, Vincent
dc.contributor.authorKenens, Bart
dc.contributor.authorWalke, Amey
dc.contributor.authorBizindavyi, Jasper
dc.contributor.authorIraci, Sara
dc.contributor.authorIbrahim, Seifallah
dc.contributor.authorHodges, Blake
dc.contributor.authorJosephsen, Trent
dc.contributor.authorPerumkunnil, Manu
dc.contributor.authorHuet, Benjamin
dc.contributor.authorO'Neal, Sabine
dc.contributor.authorHerr, Quentin
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2026-05-11T08:51:01Z
dc.date.available2026-05-11T08:51:01Z
dc.date.createdwos2026-03-18
dc.date.issued2024
dc.description.abstractSuperconducting Digital (SCD) is a promising alternative to conventional complementary metal-oxide semiconductor (CMOS) technology, enabling high-speed and energy-efficient computing for Artificial Intelligence (AI) and High-Performance Computing (HPC). Here, we report the fabrication of three device modules that are the core building blocks for scalable SCD technology: 1) NbTiN BEOL interconnects, 2) NbTiN/aSi/NbTiN Josephson junctions (JJs), and 3) NbTiN/HZO/NbTiN tunable Metal-Insulator-Metal (MIM) capacitors. Material characterization and electrical measurements demonstrate high-quality superconducting devices with critical dimensions (CDs) down to 50 nm. NbTiN interconnects have critical temperature Tc>13K and high critical current density Jc>120mA/μm2, amorphous Si α Si) based JJs have JC>0.8mA/μm2, with a ICRN of ∼1.1mV. The tunable HZO MIM capacitors have high specific capacitance Cf of ∼28 fF/μm2 and k-value of 30. All devices were fabricated on 300 mm wafers within thermal budget of 420 ∘C using fabrication processes compatible with standard CMOS technology, representing many firsts, hence bridging the gap from feasibility studies to industrial fabrication.
dc.description.wosFundingTextThe work was supported by imec Invest+ grant and Osceola County, Florida.
dc.identifier.doi10.1109/iedm50854.2024.10873563
dc.identifier.issn2380-9248
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59405
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.conferenceIEEE International Electron Devices Meeting (IEDM)
dc.source.conferencedate2025-12-07
dc.source.conferencelocationSan Francisco
dc.source.journal2024 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, IEDM
dc.source.numberofpages4
dc.title

NbTiN based two-metal level semi-damascene interconnects, Josephson junctions and capacitors for Superconducting Digital Logic

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-04-07
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-04-07
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