Publication:

Dynamics of electromigration induced void-hillock growth and precipitation/dissolution of addition elements studied by in-situ electron microscopy resistance measurements

Date

1999
Journal article
Simple item page Full metadata Statistics
 
dc.contributor.authorD'Haen, Jan
dc.contributor.authorCosemans, P.
dc.contributor.authorManca, Jean
dc.contributor.authorLekens, Geert
dc.contributor.authorMartens, T.
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorD'Olieslaeger, Marc
dc.contributor.authorDe Schepper, Luc
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorLekens, Geert
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorD'Olieslaeger, Marc
dc.contributor.imecauthorMaex, Karen
dc.date.accessioned2021-10-06T11:04:41Z
dc.date.available2021-10-06T11:04:41Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3420
dc.source.beginpage1617
dc.source.endpage1630
dc.source.issue11
dc.source.journalMicroelectronics and Reliability
dc.source.volume39
dc.title

Dynamics of electromigration induced void-hillock growth and precipitation/dissolution of addition elements studied by in-situ electron microscopy resistance measurements

dc.typeJournal article
dspace.entity.typePublication
Files
Publication available in collections:
Articles