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Wafer bonding challenges for 3-D integration
Publication:
Wafer bonding challenges for 3-D integration
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Date
2010
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21364.pdf
1.56 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jourdain, Anne
;
Miller, Andy
;
Swinnen, Bart
Journal
Abstract
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2031
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Acq. date: 2026-01-08
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Metrics
Views
2031
since deposited on 2021-10-18
2
last month
Acq. date: 2026-01-08
Citations