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Fine grain thermal modeling of 3D stacked structures
Publication:
Fine grain thermal modeling of 3D stacked structures
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Date
2009-10
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Cupak, Miroslav
;
Van der Plas, Geert
;
Vandevelde, Bart
;
Marchal, Pol
;
Srinivasan, Adi
;
Cheng, Edmund
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1904
since deposited on 2021-10-18
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Acq. date: 2025-12-11
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Views
1904
since deposited on 2021-10-18
1
last month
Acq. date: 2025-12-11
Citations