Publication:
Chip package interaction
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-21T13:41:47Z | |
| dc.date.available | 2021-10-21T13:41:47Z | |
| dc.date.issued | 2013 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/23287 | |
| dc.source.conference | Cohesie Workshop "From Electronic Building Blocks to Innovative Microsystems" | |
| dc.source.conferencedate | 13/06/2013 | |
| dc.source.conferencelocation | Leuven Belgium | |
| dc.title | Chip package interaction | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |