Publication:
3D-COSTAR: A cost model for 3D-SICs
Date
| dc.contributor.author | Taouil, Mottaqiallah | |
| dc.contributor.author | Hamdioui, Said | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.author | Bhawmik, Sudipta | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-20T16:48:58Z | |
| dc.date.available | 2021-10-20T16:48:58Z | |
| dc.date.issued | 2012-12 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/21595 | |
| dc.identifier.url | http://techventure.rti.org/Login.html | |
| dc.source.conference | 3-D Architectures for Semiconductor Integration and Packaging - 3D-ASIP | |
| dc.source.conferencedate | 12/12/2012 | |
| dc.source.conferencelocation | Redwood City, CA USA | |
| dc.title | 3D-COSTAR: A cost model for 3D-SICs | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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