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BGA solder strain prediction using an Artificial Neural Network regressor
Publication:
BGA solder strain prediction using an Artificial Neural Network regressor
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Date
2020
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ferrando Villalba, Pablo
;
Vandevelde, Bart
Journal
Abstract
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1954
since deposited on 2021-10-28
1
last month
Acq. date: 2025-12-15
Citations
Metrics
Views
1954
since deposited on 2021-10-28
1
last month
Acq. date: 2025-12-15
Citations