Publication:

Electrodeposition of Ø50 × 50 μm Cu Pillars for 3D Stacking Applications

Date

2016
Proceedings Paper
https://doi.org/10.37665/warggyb20982
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cris.virtual.orcid0000-0002-6699-1615
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cris.virtualsource.orcid12de27c7-869f-445c-8ac5-1dad7854aab4
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dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorHonore, Mia
dc.contributor.authorRadisic, Alex
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorStruyf, Herbert
dc.contributor.authorArnold, Marco
dc.contributor.authorFluegel, Alexander
dc.contributor.authorMayer, Dieter
dc.contributor.authorChang, Iris Shu-Ya
dc.date.accessioned2026-10-29T13:34:54Z
dc.date.available2026-10-29T13:34:54Z
dc.date.issued2016
dc.description.abstractABSTRACT In this work, we demonstrate defect-free plating of Ø50 × 50 μm Cu pillars, on 300 mm wafers, for 3D stacking applications. We also demonstrate the capability to control and tune within-wafer (WIW) and within-die (WID) uniformity of Cu-pillar heights to given application requirements. Furthermore, by adjusting the concentration of plating additives, we are able to modify the shape and morphology of electroplated Cu pillars.
dc.identifier.doi10.37665/warggyb20982
dc.identifier.issn3067-9052
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/60661
dc.language.isoen
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherSMTA
dc.source.conference13th Wafer-Level Packaging Symposium
dc.source.conferencedate2016-10-18
dc.source.conferencelocationSan Jose
dc.source.journal13th Wafer-Level Packaging Symposium
dc.title

Electrodeposition of Ø50 × 50 μm Cu Pillars for 3D Stacking Applications

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2025-12-02
imec.internal.sourcecrawler
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