Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Novel interconnect methodologies for ultra-thin chips on foils
Publication:
Novel interconnect methodologies for ultra-thin chips on foils
Copy permalink
Date
2012
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
25306.pdf
787.57 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sridhar, A.
;
Cauwe, Maarten
;
Fledderus, H.
;
Kusters, R.
;
van den Brand, Jeroen
Journal
Abstract
Description
Metrics
Views
1917
since deposited on 2021-10-20
2
last month
Acq. date: 2025-12-11
Citations
Metrics
Views
1917
since deposited on 2021-10-20
2
last month
Acq. date: 2025-12-11
Citations