Publication:

Flexible hybrid integration of photonic and electronic chips using aerosol-jet printing

Date

2017
Proceedings Paper
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dc.contributor.authorElmogi Mosad, Ahmed
dc.contributor.authorSoenen, Wouter
dc.contributor.authorBosman, Erwin
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorSpiga, S.
dc.contributor.authorAmann, M.-C.
dc.contributor.authorBauwelinck, Johan
dc.contributor.authorVan Steenberge, Geert
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorBauwelinck, Johan
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecBauwelinck, Johan::0000-0001-5254-2408
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.date.accessioned2021-10-24T04:35:08Z
dc.date.available2021-10-24T04:35:08Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28305
dc.source.beginpage82
dc.source.conference22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter
dc.source.conferencedate27/11/2017
dc.source.conferencelocationDelft The Netherlands
dc.source.endpage85
dc.title

Flexible hybrid integration of photonic and electronic chips using aerosol-jet printing

dc.typeProceedings paper
dspace.entity.typePublication
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