Publication:

Deep Learning-Based High Throughput Inspection in 3D Nanofabrication and Defect Reversal in Nanopillar Arrays: Implications for Next Generation Transistors

Date

2021
Journal article
https://doi.org/10.1021/acsanm.0c03283
Simple item page Full metadata Statistics
 
dc.contributor.authorAnand, Utkarsh
dc.contributor.authorGhosh, Tanmay
dc.contributor.authorAabdin, Zainul
dc.contributor.authorVrancken, Nandi
dc.contributor.authorYan, Hongwei
dc.contributor.authorXu, XiuMei
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorMirsaidov, Utkur
dc.contributor.imecauthorVrancken, Nandi
dc.contributor.imecauthorXu, XiuMei
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidextAnand, Utkarsh::0000-0003-3914-8435
dc.contributor.orcidextGhosh, Tanmay::0000-0003-0532-2407
dc.contributor.orcidextYan, Hongwei::0000-0001-5311-7614
dc.contributor.orcidextMirsaidov, Utkur::0000-0001-8673-466X
dc.contributor.orcidimecXu, XiuMei::0000-0002-3356-8693
dc.date.accessioned2023-08-07T11:36:42Z
dc.date.available2023-06-20T10:38:39Z
dc.date.available2023-08-07T11:36:42Z
dc.date.issued2021
dc.identifier.doi10.1021/acsanm.0c03283
dc.identifier.issn2574-0970
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42012
dc.publisherAMER CHEMICAL SOC
dc.source.beginpage2664
dc.source.endpage2672
dc.source.issue3
dc.source.journalACS APPLIED NANO MATERIALS
dc.source.numberofpages9
dc.source.volume4
dc.subject.keywordsSCANNING-ELECTRON-MICROSCOPY
dc.subject.keywordsCAPILLARY RISE
dc.subject.keywordsFABRICATION
dc.subject.keywordsWAFER
dc.subject.keywordsPATTERN
dc.subject.keywordsSTICTION
dc.subject.keywordsADHESION
dc.subject.keywordsMODEL
dc.title

Deep Learning-Based High Throughput Inspection in 3D Nanofabrication and Defect Reversal in Nanopillar Arrays: Implications for Next Generation Transistors

dc.typeJournal article
dspace.entity.typePublication
Files
Publication available in collections:
Articles