Publication:

Damage cluster analysis of patterned wafers during solvent spray cleaning

Date

2009
Proceedings Paper
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dc.contributor.authorHalder, Sandip
dc.contributor.authorWostyn, Kurt
dc.contributor.authorAndreas, Michael
dc.contributor.authorWada, Masayuki
dc.contributor.authorBrems, Steven
dc.contributor.authorBearda, Twan
dc.contributor.authorPacco, Antoine
dc.contributor.authorKenis, Karine
dc.contributor.authorVos, Rita
dc.contributor.authorMertens, Paul
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorWostyn, Kurt
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorPacco, Antoine
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecWostyn, Kurt::0000-0003-3995-0292
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.date.accessioned2021-10-17T22:40:20Z
dc.date.available2021-10-17T22:40:20Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15424
dc.source.beginpage219
dc.source.conferenceCleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
dc.source.endpage225
dc.title

Damage cluster analysis of patterned wafers during solvent spray cleaning

dc.typeProceedings paper
dspace.entity.typePublication
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