Publication:

Residual thermomechanical stresses in thinned-chip assemblies

Date

2000
Journal article
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dc.contributor.authorLeseduarte, S.
dc.contributor.authorMarco, S.
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorMarty, A.
dc.contributor.authorPinel, S.
dc.contributor.authorVendier, O.
dc.contributor.authorCoello-Vera, A.
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T13:15:34Z
dc.date.available2021-10-14T13:15:34Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4526
dc.source.beginpage673
dc.source.endpage679
dc.source.issue4
dc.source.journalIEEE Trans. Components and Packaging Technologies
dc.source.volume23
dc.title

Residual thermomechanical stresses in thinned-chip assemblies

dc.typeJournal article
dspace.entity.typePublication
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