Publication:

Protective layer for collective die to wafer hybrid bonding

Date

2019
Proceedings Paper
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dc.contributor.authorInoue, Fumihiro
dc.contributor.authorBertheau, Julien
dc.contributor.authorSuhard, Samuel
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorOhashi, Takuya
dc.contributor.authorKinoshita, Tetsuro
dc.contributor.authorKinoshita, Yohei
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorOhashi, Takuya
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T10:43:47Z
dc.date.available2021-10-27T10:43:47Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33194
dc.identifier.urlhttps://ieeexplore.ieee.org/document/9058870
dc.source.conferenceInternational 3D Systems Integration Conference - 3DIC 2019
dc.source.conferencedate8/10/2019
dc.source.conferencelocationSendai Japan
dc.title

Protective layer for collective die to wafer hybrid bonding

dc.typeProceedings paper
dspace.entity.typePublication
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