Publication:

Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium

Date

2020
Proceedings Paper
https://doi.org/10.1109/IEDM13553.2020.9372096
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dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorPuliyalil, Harinarayanan
dc.contributor.authorVersluijs, Janko
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorBaert, Rogier
dc.contributor.authorPaolillo, Sara
dc.contributor.authorDecoster, Stefan
dc.contributor.authorSchleicher, Filip
dc.contributor.authorMontero Alvarez, Daniel
dc.contributor.authorBekaert, Joost
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorLorant, Christophe
dc.contributor.authorTeugels, Lieve
dc.contributor.authorHeylen, Nancy
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorCiofi, Ivan
dc.contributor.imecauthorVega-Gonzalez, V.
dc.contributor.imecauthorPuliyalil, H.
dc.contributor.imecauthorVersluijs, J.
dc.contributor.imecauthorLesniewska, A.
dc.contributor.imecauthorVarela-Pereira, O.
dc.contributor.imecauthorBaert, R.
dc.contributor.imecauthorPaolillo, S.
dc.contributor.imecauthorDecoster, S.
dc.contributor.imecauthorSchleicher, F.
dc.contributor.imecauthorMontero, D.
dc.contributor.imecauthorBekaert, J.
dc.contributor.imecauthorKesters, E.
dc.contributor.imecauthorLe, Q. T.
dc.contributor.imecauthorLorant, C.
dc.contributor.imecauthorTeugels, L.
dc.contributor.imecauthorHeylen, N.
dc.contributor.imecauthorJourdan, N.
dc.contributor.imecauthorEl-Mekki, Z.
dc.contributor.imecauthorvan der Veen, M.
dc.contributor.imecauthorCiofi, I
dc.contributor.orcidimecPuliyalil, Harinarayanan::0000-0002-9749-5307
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecSchleicher, Filip::0000-0003-3630-7285
dc.contributor.orcidimecMontero Alvarez, Daniel::0000-0001-9966-0399
dc.contributor.orcidimecBekaert, Joost::0000-0003-3075-3479
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecLorant, Christophe::0000-0001-7363-9348
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecLee, Jae Uk::0000-0002-9434-5055
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-12-16T14:17:58Z
dc.date.available2021-12-06T02:06:16Z
dc.date.available2021-12-16T14:15:40Z
dc.date.available2021-12-16T14:17:58Z
dc.date.issued2020
dc.identifier.doi10.1109/IEDM13553.2020.9372096
dc.identifier.eisbn978-1-7281-8888-1
dc.identifier.issn2380-9248
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38538
dc.publisherIEEE
dc.source.conferenceIEEE International Electron Devices Meeting (IEDM)
dc.source.conferencedateDEC 12-18, 2020
dc.source.conferencelocationSan Francisco, CA, USA
dc.source.journalna
dc.source.numberofpages4
dc.title

Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium

dc.typeProceedings paper
dspace.entity.typePublication
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