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Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask

Date

2003
Proceedings Paper
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dc.contributor.authorSiau, Sam
dc.contributor.authorDegrendele, Lieven
dc.contributor.authorDe Baets, Johan
dc.contributor.authorVan Calster, Andre
dc.contributor.imecauthorDegrendele, Lieven
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.imecauthorVan Calster, Andre
dc.date.accessioned2021-10-15T06:38:19Z
dc.date.available2021-10-15T06:38:19Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8136
dc.source.beginpage158
dc.source.conference26th International Spring Seminar on Electronics Technology. Integrated Management of Electronic Materials Production. ISSE
dc.source.conferencedate8/05/2003
dc.source.conferencelocationStara Lesna Slovakia
dc.source.endpage162
dc.title

Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask

dc.typeProceedings paper
dspace.entity.typePublication
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