Publication:

Post processing of a SiNy-based photonic stack above a CMOS imager sensor

Date

2018
Proceedings Paper
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dc.contributor.authorPham, Nga
dc.contributor.authorTyagi, Hemant Kumar
dc.contributor.authorDu Bois, Bert
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorWinderickx, Gillis
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorTilmans, Harrie
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorTyagi, Hemant Kumar
dc.contributor.imecauthorDu Bois, Bert
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.imecauthorWinderickx, Gillis
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecDu Bois, Bert::0000-0003-0147-1296
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.date.accessioned2021-10-26T01:09:13Z
dc.date.available2021-10-26T01:09:13Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31522
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8654381
dc.source.beginpage50
dc.source.conference2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
dc.source.conferencedate4/12/2018
dc.source.conferencelocationSingapore Singapore
dc.source.endpage54
dc.title

Post processing of a SiNy-based photonic stack above a CMOS imager sensor

dc.typeProceedings paper
dspace.entity.typePublication
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