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Nanoindentation methodologies for characterizing thin (porous) low dielectric constant materials and copper pads
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Acq. date: 2026-08-09
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Acq. date: 2026-08-09
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1 since deposited on 2021-10-29
Acq. date: 2026-08-09
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2054 since deposited on 2021-10-29
1last month
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Acq. date: 2026-08-09
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