Review-Modeling Methods for Analysis of Electromigration Degradation in Nano-Interconnects

dc.contributor.author	Ceric, H.
dc.contributor.author	Selberherr, S.
dc.contributor.author	de Orio, R. L.
dc.contributor.author	Zahedmanesh, Houman
dc.contributor.author	Croes, Kristof
dc.contributor.imecauthor	Zahedmanesh, Houman
dc.contributor.imecauthor	Croes, Kristof
dc.contributor.orcidext	Ceric, H.::0000-0003-0918-7732
dc.contributor.orcidext	Selberherr, S.::0000-0002-5583-6177
dc.contributor.orcidimec	Croes, Kristof::0000-0002-3955-0638
dc.date.accessioned	2022-02-23T16:08:26Z
dc.date.available	2022-02-23T16:08:26Z
dc.date.issued	2021
dc.identifier.doi	10.1149/2162-8777/abe7a9
dc.identifier.issn	2162-8769
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/39071
dc.publisher	ELECTROCHEMICAL SOC INC
dc.source.beginpage	035003
dc.source.issue	3
dc.source.journal	ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
dc.source.numberofpages	11
dc.source.volume	10
dc.title	Review-Modeling Methods for Analysis of Electromigration Degradation in Nano-Interconnects
dc.type	Journal article review
dspace.entity.type	Publication
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