Publication:

Reduced self-heating by strained silicon substrate engineering

Date

 
dc.contributor.authorO'Neill, A.
dc.contributor.authorOlsen, S.
dc.contributor.authorYang, Y.
dc.contributor.authorAgaiby, R.
dc.contributor.authorHellstrom, P.E.
dc.contributor.authorOstling, M.
dc.contributor.authorLyutovich, K.
dc.contributor.authorKasper, E.
dc.contributor.authorEneman, Geert
dc.contributor.authorVerheyen, Peter
dc.contributor.authorLoo, Roger
dc.contributor.authorClaeys, Cor
dc.contributor.authorFiegna, C.
dc.contributor.authorSangiorgio, E.
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorVerheyen, Peter
dc.contributor.imecauthorLoo, Roger
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecLoo, Roger::0000-0003-3513-6058
dc.date.accessioned2021-10-16T18:18:21Z
dc.date.available2021-10-16T18:18:21Z
dc.date.embargo9999-12-31
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12643
dc.source.conference5th International Symposium on Control of Semiconductor Interfaces - ISCSI-V
dc.source.conferencedate12/11/2007
dc.source.conferencelocationTokyo Japan
dc.title

Reduced self-heating by strained silicon substrate engineering

dc.typeMeeting abstract
dspace.entity.typePublication
Files

Original bundle

Name:
15694.pdf
Size:
171.48 KB
Format:
Adobe Portable Document Format
Publication available in collections: