Publication:
Conformal antenna-in-package solution implemented in a 3D flex-rigid multilayer PCB technology
Date
| dc.contributor.author | Enayati, Amin | |
| dc.contributor.author | Libois, Michael | |
| dc.contributor.author | De Raedt, Walter | |
| dc.contributor.author | Vandenbosch, Guy | |
| dc.contributor.imecauthor | Libois, Michael | |
| dc.contributor.imecauthor | De Raedt, Walter | |
| dc.contributor.orcidimec | De Raedt, Walter::0000-0002-7117-7976 | |
| dc.date.accessioned | 2021-10-19T13:24:51Z | |
| dc.date.available | 2021-10-19T13:24:51Z | |
| dc.date.issued | 2011 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18880 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | Asian-Pacific Microwave Conference | |
| dc.source.conferencedate | 5/12/2011 | |
| dc.source.conferencelocation | Melbourne Australia | |
| dc.source.endpage | 4 | |
| dc.title | Conformal antenna-in-package solution implemented in a 3D flex-rigid multilayer PCB technology | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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