Publication:

3D systems-in-a-package for wireless sensor nodes

Date

2007
Presentation
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dc.contributor.authorVan Hoof, Chris
dc.contributor.imecauthorVan Hoof, Chris
dc.date.accessioned2021-10-16T20:41:13Z
dc.date.available2021-10-16T20:41:13Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13059
dc.source.conferenceInternational Solid-State Circuits Conference - ISSCC
dc.source.conferencedate11/02/2007
dc.source.conferencelocationSan Francisco, CA USA
dc.title

3D systems-in-a-package for wireless sensor nodes

dc.typeOral presentation
dspace.entity.typePublication
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